Polyimide capacitors

Superior dielectric energy storage performance for high

Polyimides have garnered attention as promising dielectric materials for high

Polyimides as High Temperature Capacitor Dielectrics

This chapter discusses the important criteria for high temperature polymer

Polyimide composites crosslinked by aromatic molecules for high

In summary, we have successfully substantiated that polyimide-based

Sulfonyl‐Containing Polyimide Dielectrics with

Specifically, the polyimide (SPI-1) with sulfonyl group in diamine moiety and para-para linkage shows stable dielectric properties up to 150 °C, and the discharged energy density and charge–discharge efficiency can be as

The scalable and high performance polyimide dielectrics

Polyimide (PI) dielectrics have attracted much attention in the field of film capacitors because of outstanding high temperature resistance, well film-forming and mechanical properties. However, high conductive loss leads to low energy density and efficiency at elevated temperatures, which is caused by the conjugation effect of the

High dielectric constant polyimide for high-temperature film

Polymer film capacitors do not meet the increasing demand of high

Scalable High‐Permittivity Polyimide Copolymer with

Here, a modularized molecular engineering strategy is reported to enhance the high-temperature capacitive performance of polymer dielectrics. First, the potential influences of multiple structural units on εr, Tg,

Superior dielectric energy storage performance for high

Polyimides have garnered attention as promising dielectric materials for high-temperature film capacitors due to their exceptional heat resistance. However, conventional polyimides with narrow bandgaps suffer from significant conduction loss at high temperatures and high electric fields.

Chapter Polyimides as High Temperature Capacitor Dielectrics

capacitor dielectrics and presents a comprehensive review on commercial resin development up to recent research progress on polyimide (PI) targeted for operat-ing temperature above 150°C. While many review articles on various aspects of polymeric capacitor dielectrics are available [25–32], this chapter has a specific

Polyimide Dielectrics with Cross-linked Structure for High

DOI: 10.1016/j.mtener.2022.101243 Corpus ID: 255654704; Polyimide Dielectrics with Cross-linked Structure for High-Temperature Film Capacitors @article{Wu2023PolyimideDW, title={Polyimide Dielectrics with Cross-linked Structure for High-Temperature Film Capacitors}, author={Zhiqiang Wu and Yiwen Peng and Ying Song and Haoyu Liang and Lei Gong and

Polyimide Dielectrics with Cross-linked Structure for

Download Citation | On Jan 1, 2023, Zhiqiang Wu and others published Polyimide Dielectrics with Cross-linked Structure for High-Temperature Film Capacitors | Find, read and cite all the research

High-temperature polyimide dielectric materials for

Dielectric capacitors with a high operating temperature applied in electric vehicles, aerospace and underground exploration require dielectric materials with high temperature resistance and high energy density. Polyimide

Polyimide composites crosslinked by aromatic molecules for high

In summary, we have successfully substantiated that polyimide-based composite with a crosslinking structure exhibits a significantly enhanced high-temperature capacitance performance, outperforming the currently reported dielectric polymers with a single strategy. More importantly, we have deeply explored the rationality of the

The scalable and high performance polyimide dielectrics

Polyimide (PI) dielectrics have attracted much attention in the field of film

High-temperature polyimide dielectric materials for

Polyimide (PI) turns out to be a potential dielectric material for capacitor applications at high temperatures. In this review, the key parameters related to high temperature resistance and energy storage characteristics

Scalable High‐Permittivity Polyimide Copolymer with Ultrahigh

Here, a modularized molecular engineering strategy is reported to enhance the high-temperature capacitive performance of polymer dielectrics. First, the potential influences of multiple structural units on εr, Tg, and Eg of polymers are elucidated by comparing a set of polyimides (PIs).

Polyimides as High Temperature Capacitor Dielectrics

Nearly five decades of effort has focused on identifying and developing new polymer capacitor films for higher-than-ambient temperature applications, but simultaneous demands of processability,...

High-temperature polyimide dielectric materials for energy

Polyimide (PI) turns out to be a potential dielectric material for capacitor applications at high temperatures. In this review, the key parameters related to high temperature resistance and energy storage characteristics were introduced and recent developments in all-organic PI dielectrics and PI-matrix dielectric nanocomposites were discussed

Rationally Designed Polyimides for High-Energy

Polyimide with high dielectric constants of up to 7.8 that exhibits low dissipation factors (<1%) and high energy density around 15 J/cm 3, which is 3 times that of BOPP, was prepared. Our syntheses were guided by high

Polyimides as High Temperature Capacitor Dielectrics

This chapter discusses the important criteria for high temperature polymer capacitor dielectrics and presents a comprehensive review on commercial resin development up to recent research progress on polyimide (PI) targeted for operating temperature above 150°C.

Metallized stacked polymer film capacitors for high-temperature

Metallized film capacitors towards capacitive energy storage at elevated temperatures and electric field extremes call for high-temperature polymer dielectrics with high glass transition temperature (T g), large bandgap (E g), and concurrently excellent self-healing ability.However, traditional high-temperature polymers possess conjugate nature and high S

Polyimide composites crosslinked by aromatic molecules for high

Dielectric capacitors have widely played a key role in modern advanced electronics and circuit systems for controlling and storing charges owing to their intrinsic fast charge–discharge capability and extremely high power density [1], [2], [3].Polymer-based dielectric materials with superior advantages, including ultra-high breakdown strength and

High-temperature capacitive energy storage in polymer

Dielectric energy storage capacitors with ultrafast charging-discharging rates are indispensable for the development of the electronics industry and electric power systems 1,2,3.However, their low

Polymer Capacitor Dielectrics for High Temperature Applications

Much effort has been invested for nearly five decades to identify and develop new polymer capacitor dielectrics for higher than ambient temperature applications. Simultaneous demands of processability, dielectric permittivity, thermal conductivity, and dielectric breakdown strength dictated by increasing high power performance criteria limit the number of available

High dielectric constant polyimide for high-temperature film capacitor

Polymer film capacitors do not meet the increasing demand of high-temperature (> 125 °C) applications with the rapid development of new energy. In particular, few polymer dielectrics can operate at high temperatures (> 250 °C). In order to develop high-temperature-resistant polymer dielectrics, a novel polyimide containing

Multi-layered boron nitride/polyimide high-temperature capacitor

Polyimide (PI) is considered a potential candidate for high-temperature energy storage dielectric materials due to its excellent thermal stability and insulating properties. This review expounds on the design strategies to improve the energy storage properties of polyimide dielectric materials from the perspective of polymer multiple structures, including short-range

Rationally Designed Polyimides for High-Energy Density Capacitor

Polyimide with high dielectric constants of up to 7.8 that exhibits low dissipation factors (<1%) and high energy density around 15 J/cm 3, which is 3 times that of BOPP, was prepared. Our syntheses were guided by high-throughput density functional theory calculations for rational design in terms of a high dielectric constant and

Sulfonyl‐Containing Polyimide Dielectrics with Advanced Heat Resistance

Specifically, the polyimide (SPI-1) with sulfonyl group in diamine moiety and para-para linkage shows stable dielectric properties up to 150 °C, and the discharged energy density and charge–discharge efficiency can be as high as 7.04 J cm −3 and 91.3% at 500 MV m −1, respectively.

Polyimide capacitors

6 FAQs about [Polyimide capacitors]

Can polyimide be used as a dielectric capacitor?

Dielectric capacitors with a high operating temperature applied in electric vehicles, aerospace and underground exploration require dielectric materials with high temperature resistance and high energy density. Polyimide (PI) turns out to be a potential dielectric material for capacitor applications at high temperatures.

Can polyimides be used for film capacitors at high temperature?

The blending polyimides films possess high permittivity up to 7.9, low dielectric loss below 0.08, and a maximum energy density of 2.87 J cm−3. Meantime, the polyimides possess excellent mechanical property and excellent thermal stability. These obtained polyimide blends can be used for film capacitors at high temperature. 2 Experimental

Are alicyclic polyimides suitable for capacitor energy storage?

In general, polyimides with an alicyclic structure were successfully prepared for capacitor energy storage at elevated temperatures. The semi-aromatic PI not only maintains the high temperature resistance, but also weakens the long distance conjugation effect of the main chain and possesses a wide band gap.

Can polyimide be used for capacitor energy storage?

Polyimide with an alicyclic structure was prepared for capacitor energy storage. High bandgap width and weak charge transfer complex improve energy storage property. Conductive and breakdown mechanism were investigated at high temperature. Discharge energy density of 4.63 J cm −3 was obtained at room temperature.

Are Aromatic polyimides a good capacitor dielectric?

Demands on these criteria are even more stringent in growing numbers of applications demanding high power performance. Aromatic polyimides, though not a panacea, are a class of heat-resistant polymers of great interest to researchers as capacitor dielectrics because of good thermal and mechanical stability.

Are polymer film capacitors suitable for high-temperature applications?

Abstract Polymer film capacitors do not meet the increasing demand of high-temperature (> 125 °C) applications with the rapid development of new energy. In particular, few polymer dielectrics can operate at high temperatures (> 250  °C).

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